If you’re working with fine pitch components and connection systems, this technology offers you a new way to achieve a competitive advantage – because we’ve driven flexible conductive circuit pitch capabilities down to a market-leading 0.5mm track and gap.

Our ultra fine pitch product uses additive circuit materials on lower temperature polymer substrates. You benefit from similar properties to metalised copper conductors found in standard FR4 printed circuit board structures, but with the following benefits:

  • Market-leading track and gap: of just 0.5mm
  • Reduced weight and cost: thanks to our additive approach and proprietary screen print technologies
  • Greater formability: using lower temperature polymer substrates

We’re pushing the boundaries of this technology type and substrate solution set, bringing it closer to polyimide-based products and breaking down barriers around formability, weight and cost.

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Let’s redefine what you can do with electronics by breaking down your design barriers and streamlining your supply chain.

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