Basic Info
Technical Info
RFQ
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The following are typical characteristics of a flexible circuits. Actual performance depends
upon many factors. IN2TEC routinely provides solutions to design challenges - often
working outside the bounds of these typical parameters. For design assistance on specific
applications, please consult your local sales support.
Polyimide has proven performance as the material of choice in applications involving very high or
very low operating temperatures, In2tec can alsdo vary the process by using Kapton® as a
solderable media utilising subtractive etching processes or a more cost effective printed version
but with slightly higher resistance properties.
- High Power Appilcation: maintains its excellent physical, el;ectrical and mechanical
properties over a wide temperature range.
- High Mechanical Strength: Excellent chemical resistance, can be laminated, metallised,
punched, formed, or adhesive coated.
- Large Scale Components: The ability to solder components onto the substrate allows for
large size components to be accommodated.
- Ultra Fine Track Width: with line widths capable of providing very fine tolerances, large
scale integration and package sizes down to 0204 are easily accommodated.
There is a pronounced drive in the industry to provide products that can replicate hard stubstrate
pcb's whilst providing a design that will support complex curves, In2tec produces Polymer Thick
Film (P.T.F) circuits to answer this.
- Cost: Polyester substrate provides a significant material cost saving versus conventional
FR4 copper board or flexible Kapton technology.
- Environmental: Conductive adhesive technology provides a lead free manufacturing
process with copper free conductors, providing a more environmentally acceptable
alternative.
- Interconnection: Flexible circuit technology can reduce the necessity for additional flying
leads, thereby reducing board to board connection requirements by 50%.
- Flexibility: Flexible circuits have an inherent free flow curve following capability,
minimising front surface design constraints such as In2tec's Polyform 3D circuits utilising
conductive contouring processes.
- Flat Panel Intergration: With their extremely low profile and flexibility, polyester circuits
provide lower manufacturing costs for total Front panel assembly, by providing all the
components on one circuit without the need for holes, soldering or mounting.
- Weight Saving: As with the cost, the material content provides a significant weight
reduction versus copper bases conductors and can reduce the need for additional mounting
boards.
In2tec's revolutionary conductive contouring process has broken down the barriers between rigid
printed circuit layers, flexi rigid conductors and complex moulded panels providing a three
dimensional polymer thick film circuit. Forming circuit layers to a pre-defined 3D structure
provides a unique opportunity to save space and weight whilst opening up design concepts that
would not have been possible.
Automotive: flex circuits that follow the aesthetic curves of a heavily contoured intrument panel.
Telecomms: Provision of a keypad switching and illumination in a significantly small space
envelope.
ATM Banking: Oppertunity to minimise pcb mounting problems by utilising adhesive technologies
to fundamentally"stick" the polyform 3D circuit directly to a contoured space.
Designed and developed exclusively by In2tec "Combitec" is a hybrid of polymide and polyester
flexible circuit processes which can be combined and configured according to our customer's
requirements. Providing far more scope for products and acting as a perfect balance between
high/low power and cost sensitive applications.
The Innovation of Combitec utilises the unique properties of Kapton® to balance disadvantages
Polymer Thick Film (PTF) may have and complement PTF's obvious benefits.
Combitec addresses cost restrictions and limitations of design requirements to provide an
unequalled capability to deliver high specification but low cost soloutions.
A number of our customers are already experiencing the benefits of this technology and enjoy
significant cost savings over the more conventional processes. |
