We give you the groundbreaking ability to form the conductive circuit to the shape of the end product. This systematically creates product advantages in shape, weight, space and overall cost.

Currently the market standard is for planar, 2D hard or flexible substrate circuit systems. Our innovation is the art of producing 3D complex curved conductive circuit substrates that break down design barriers.

Our proprietary complex modelling software provides forecasted circuit layouts to create the exact electrical and physical properties your design requires, which significantly reduces electrical inefficiencies when compared to other circuit board solutions.

Benefit from conductive contouring with In2Sense 3D, the world’s first complex curved, smartphone-style interface panel


Let’s redefine what you can do with electronics by breaking down your design barriers and streamlining your supply chain.

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